Laser
 Techniques Co.
 6742 185th Ave NE, Suite 300
 Redmond, WA 98052
 
 Phone:
 (425) 885-0607
 
 Fax:
 (425) 885-0802

Technologies

LTC offers non-contact measurement and inspection solutions using laser-based sensors. For inspection of critical components, LTC has developed a wide range of products based on three core technologies. All of LTC’s technologies are supported by our Laser MicroMap™ system and utilize our LaserViewer™ software for flexible data acquisition, real-time display of collected data, and data analysis. LTC has developed a standard product line to meet the needs of a number of diverse applications, and can quickly adapt those products to new requirements.

Laser Profile Mapping for non-contact measurement of critical components

Laser Profile Mapping

Laser profile mapping provides precise non-contact measurement and 3D images of tubes, bores, plates, and complex surfaces. These sensors are high resolution “laser calipers” that take a rapid succession of single-point distance measurements while scanning over the target surface. The result is a 3D image that provides a quantitative map of the inspected part. Features such as pits, erosion and deformation can me rapidly located and measured.

LaserVideo™ Imaging for non-contact inspection of difficult-to-access surfaces

LaserVideo™ Imaging

A highly focused laser spot provides high-resolution, undistorted images of hard-to-access surfaces such as tubes and bores, revealing features such as cracks, scratches, stains, and variations in surface roughness. These images are acquired along with the profile data and provide a visual image that complements the topographical data set.

Laser-Scanned Penetrant Inspection (LSPI™) for non-contact crack detection

Laser-Scanned Fluorescent Penetrant Inspection

A patented Laser-Scanned Penetrant Inspection (LSPI™) technique provides automated FP inspection for real-time detection and mapping of surface-breaking cracks and other defects.  This non-contact inspection method is ideal for detecting surface defects in difficult-to-access components.


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